Amazon Leo is an initiative to launch a constellation of Low Earth Orbit satellites that will provide low-latency, high-speed broadband connectivity to unserved and underserved communities around the world.
The Role:
Be part of Amazon Leo’s ASIC team responsible for defining and implementing the digital chip SOCs for communications via Low Earth Orbit satellites and Amazon gateways. This is a unique opportunity to define a groundbreaking wireless solution with few legacy constraints. The team works with customer requirements and wireless system teams to define modems, high-speed interfaces, embedded processors, and DSP solutions in the advanced technology nodes.
You will have the responsibility to develop back-end strategies and drive implementation for a set of communications chips that enable 5G-like communication between space and ground.
Key job responsibilities
• Work with RTL/logic designers to drive architectural feasibility studies, explore power-performance-area tradeoffs for physical design closure
• Drive IO/Core block physical implementation through synthesis, floor planning, bus / pin planning, place and route, power/clock distribution, congestion analysis, timing closure, IR drop analysis, physical verification, ECO and sign-off
• Develop physical design methodologies
• Evaluate 3rd party IP and provide recommendations
• Be a highly-valued member of our start-up like team through excellent collaboration and teamwork with other physical design engineers as well as with the RTL/Arch. Teams
Export Control Requirement: Due to applicable export control laws and regulations, candidates must be a U.S. citizen or national, U.S. permanent resident (i.e., current Green Card holder), or lawfully admitted into the U.S. as a refugee or granted asylum.
